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Capabilities · Layer counts up to 60 layers · Board thickness from 0.015" to 0.450" · Microvias and High Density Interconnect Constructions · Buried and Blind Vias · Copper weight from 5 microns to 343 microns (10 oz.) · Aspect ratio to 20 : 1; Panel size to 31" x 52" · U.L. approved to 2 mils line width and spacing · High-performance materials and hybrid constructions · Alternative surface finishes; Rigid and rigid flex circuits
Engineering Services · DFM and PCB Design · Dedicated Quick-turn Technology Centers, 1-5 day turns
Customer Product Management Programs · Single point of contact · Dedicated program/account management · Accelerated response to inquiries, quotations and work order status · Capacity reservation program · Integrated supply chain business system · 24-hour customer service and support
Quality and Reliability Assurance Programs · Inter-company product transfer plan · Product analysis and reliability testing · Benchmarking of best practices worldwide · Global web-based communication tools · Process control and web-based FMEA
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